Patent-powered QC For One-stop Quality Delivery
Sajet integrates self-developed power topology, control algorithm and advanced packaging patents with full-chain standardized QC systems to deliver one-stop quality guarantee from chip design to overseas application support for global clients. Design precision defects are avoided via SPICE simulation and thermal analysis during R&D; qualified wafer and packaging material suppliers are strictly audited with full incoming component testing; three-level inspection rules control packaging and testing craftsmanship in real time; all modules undergo HTOL high-temperature operating life and temperature cycling tests to eliminate hidden running faults; full rechecks on electrical parameters, appearance and packaging are finished before shipment, with extra moisture & shock-proof packaging tests for export units. The professional team covers R&D, packaging testing, QC and FAE field application with a 12-hour fast complaint response and full-lifecycle batch traceability system, collecting global module operation data to iterate QC standards. Supported by AEC-Q100 Grade 1, IATF 16949, ISO 9001 and ISO 14001 certifications, Sajet delivers highly stable DC/DC buck modules for consumer electronics, automotive electronics, industrial automation and data center industries with solid power technology and rigorous testing.
5-level Full-chain QC System
Sajet builds a closed-loop 5-level QC system covering design, incoming material, packaging production, finished product and shipment, complying with ISO standards to eliminate quality risks from the source. Triple design reviews and SPICE & thermal simulation during R&D avoid electrical performance deviation and thermal design defects. IQC fully inspects wafers, lead frames, molding compounds and bonding wires, isolating defective materials. IPQC patrols packaging process every two hours to monitor wire bonding quality, molding pressure and dicing precision. All finished modules undergo HTOL high-temperature operating life, temperature cycling and high-voltage tests simulating actual working conditions. OQC completes full inspection on electrical parameters including conversion efficiency, output voltage accuracy and output ripple, plus appearance and packaging with traceable reports. Equipped with professional power semiconductor QC labs and precision testing tools including ATE systems, thermal imagers and high-bandwidth oscilloscopes, the system fits RE4623 synchronous buck converters, RE4650 automotive-grade modules, multi-phase high-current modules and ultra-low quiescent current buck ICs, delivering stable DC/DC solutions for global clients and cutting field application failure losses.
Quality Guarantee
Strict IQC Lays Solid Quality Foundation
Sajet regards incoming inspection as the first quality barrier with standardized supplier access and wafer & packaging material testing procedures. All wafers, lead frames, molding compounds, bonding wires and substrates come with original factory certificates of analysis. We set quantitative standards for power MOSFET dies, control IC wafers, integrated inductors and multilayer ceramic capacitors, testing wafer thickness, doping concentration, electrical parameter consistency and bonding strength. Lead frames are checked for plating uniformity and flatness; bonding wires are tested for tensile strength and elongation. QC teams follow AQL sampling rules aligned with JEDEC and AEC-Q100 standards; batches failing electrical parameter, appearance or moisture sensitivity tests are rejected with supplier rectification tracking. Supported by a material database built on self-developed power topology and advanced packaging patents, we select high-stability materials to avoid wire bonding failure, thermal fatigue and parameter drift, meeting strict long-term mass production demands of consumer electronics, automotive electronics, industrial automation and data center industries.
Strict IPQC Lays Solid Process Quality Foundation
Sajet implements regular IPQC patrols across three QC zones: wafer fabrication & front-end, packaging assembly, and final test & binning. Full-time inspectors audit key process parameters hourly. For wafer fabrication, we monitor lithography alignment accuracy, etching depth uniformity and doping concentration consistency; packaging assembly checks wire bonding pull strength, molding pressure and dicing precision; final test stations record probe contact pressure, test temperature and electrical parameter binning data. All parameters are logged; production pauses for rectification once fluctuations occur to stop defective semi-finished goods. The workshop adopts self-inspection, mutual inspection and professional inspection rules aligned with JEDEC and AEC-Q100 standards. Operators self-check finished units before QC re-verification to block packaging and testing defects, ensuring consistent craftsmanship for all DC/DC buck modules including RE4623, RE4650 and multi-phase high-current series, meeting high-standard overseas delivery demands.
HTOL Full-load Aging Simulation Test
All Sajet DC/DC buck modules pass high-temperature operating life full-load aging tests simulating round-the-clock actual application conditions, serving as core finished product QC procedure. Testing covers RE4623 synchronous buck converters, RE4650 automotive-grade modules, multi-phase high-current modules and ultra-low quiescent current buck ICs with cyclic light/heavy load, frequent dynamic load switching and high-temperature overload modes. Real-time data on junction temperature, conversion efficiency, output voltage accuracy, output ripple and thermal stability are recorded. Any abnormality including efficiency degradation, output drift, over-temperature protection trigger and parameter deviation triggers failure analysis and calibration until stable parameters are achieved. Constant temperature & humidity aging rooms aligned with AEC-Q100 and JEDEC standards eliminate environmental interference to replicate overseas client application conditions including automotive under-hood high temperature and data center thermal environments, revealing hidden long-term faults and cutting field application failure risks for consumer electronics, automotive electronics, industrial automation and data center power systems.
Full Precision FQC Inspection Before Release
Special OQC for Export Modules
Sajet launches exclusive export OQC procedures complying with electrical, environmental and packaging standards of North America, Europe, Southeast Asia, Korea and Japan. Before shipment, module parameters are rechecked against custom solutions with repeated key HTOL aging performance tests. Special inspections cover MSL moisture-proof vacuum packaging, shockproof ESD trays and anti-static treatment to prevent damage during ocean and air transportation. Complete English datasheets, application notes, evaluation board design files and certificates of analysis are verified. Inspectors match model, quantity and labels including RoHS, REACH and country-of-origin tags with sales contracts and attach traceable lot codes, archiving full packaging and loading records. Consumer-grade, automotive-grade and industrial-grade modules are tested separately against AEC-Q100, JEDEC and IPC standards with independent QC reports. Rigorous export QC ensures intact module delivery for fast design-in and volume production at overseas electronics, automotive and data center factories.
Certified QC Team Standardized Operation
Sajet builds an independent full-time QC team with certified key inspectors receiving regular training on semiconductor process, power device testing, electrical safety, AEC-Q100 & JEDEC standards and export compliance to handle multi-category module inspection. The team is split into incoming IQC, in-process IPQC, HTOL aging, finished FQC and export OQC groups with standardized SOPs defining ATE test systems, oscilloscopes, thermal imagers, testing steps, pass thresholds and defect handling rules for unified judgment to cut human error. The QC department operates separately from production with authority to stop production for rectification regardless of schedules. Monthly quality review meetings summarize defect data, cooperating with R&D and packaging test teams to analyze root causes via 8D problem-solving methodology and update prevention plans under PDCA continuous improvement cycles. Professional standardized QC manpower steadily lifts finished product yield rate, meeting automotive-grade zero-defect requirements for global clients.
One Code For Full Lifecycle Traceability
Sajet builds a digital traceability system with unique lot codes and serial numbers for every module, linking full data from wafer warehousing, packaging assembly, HTOL aging, FQC testing and export shipment. Scanning retrieves wafer lots, packaging batches, operators, inspection timestamps, electrical parameters including conversion efficiency, output voltage accuracy and output ripple, HTOL aging curves and MSL moisture-proof packaging records. For on-site application faults, FAE and QC teams trace wafer suppliers, packaging steps and test records to finish root cause analysis with 8D reports within 48 hours. All paper QC reports, third-party AEC-Q100 & JEDEC certificates, certificates of analysis and RoHS/REACH compliance documents are stored permanently on cloud to meet overseas audit demands aligned with IATF 16949 traceability requirements. Digital traceability eliminates information silos for transparent full-lifecycle quality control, accelerating field application troubleshooting and boosting global clients’ trust in DC/DC module quality.
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