RE4650: The Cost-Effective Powerhouse for High-Volume Applications

RE4650 is a high-current DC/DC power module that delivers exceptional performance at a competitive price point, making it ideal for cost-sensitive, high-volume applications such as mid-range servers and consumer high-performance PCs. It provides up to 50A of output current (dual 25A or single 50A) in a compact 16x16mm BGA package, offering a highly integrated solution that reduces component count and PCB space. Despite its focus on cost-effectiveness, it does not compromise on performance, featuring fast transient response and comprehensive protection features to ensure reliable operation.
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RE4650: Dual 25A Ultra-High Current Power Module

The Ultimate Power Solution for Core Processor Power Delivery A flagship power module targeting high-performance computing and core networking hardware, the RE4650 delivers dual 25A independent outputs (or a consolidated single 50A rail). Specially optimized to power cutting-edge CPUs, FPGAs and ASIC cores, it accepts 4.5V~15V input and features a low-voltage 0.6V~1.8V output range tuned for maximum conversion efficiency in low-voltage high-current applications. Equipped with an integrated differential remote sense amplifier, it precisely compensates voltage drop across PCB traces, confining load-point voltage accuracy within ±1.5%.

 

Housed in a 16mm × 16mm × 5.01mm package integrating sophisticated power-stage circuitry, the RE4650 supports multi-phase operation and external frequency synchronization, enabling scalable power systems rated for hundreds of amperes. Its on-chip temperature diode and complete fault protection suite (including foldback overcurrent limiting) deliver bank-grade protection for high-value core semiconductors. As a compatible pin-to-pin alternative to the LTM4650, it serves as a core building block for constructing high-reliability, high-power-density power systems deployed in data centers and communication base stations.

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RE4650: The Ultimate Core Power Solution for High-Performance Computing

Uncompromising power and precision control are the core strengths of the RE4650 DC/DC power module. It integrates a high-current switching controller, power MOSFETs, inductors, and all supporting components within a 16×16×5.01mm BGA package. Supporting a 4.5V~15V input and delivering dual 25A (or single 50A) outputs at 0.6V~1.8V, it is engineered to power the most demanding CPUs and FPGAs. Its integrated differential remote sense amplifier provides exceptional load regulation, ensuring precise voltage delivery even under heavy dynamic loads.
Built to meet the stringent requirements of data centers and communication infrastructure, the RE4650 operates reliably from -40°C to 125°C. Support for multi-phase parallel operation and frequency synchronization allows for scalable power solutions, while comprehensive protection features ensure the safety of critical components. As a fully pin-to-pin compatible alternative to the LTM4650, it offers a seamless path to higher performance and reliability, minimizing redesign efforts for system upgrades.

Sajet Step-Down Power IC

  • Dual 25A or Single 50A Output
  • W ide Input Voltage Range: 4.5V to 15V
  • Output Voltage Range: 0.6V to 1.8V
  • ±1.5% Maximum Total DC Output ErrorOver Line, Load and Temperature
  • Differential Remote Sense Amplifier
  • Current Mode Control/Fast TransientResponse
  • >Adjustable Switching Frequency
  • Overcurrent Foldback Protection
  • >Multiphase Parallel with CurrentSharing
  • Frequency Synchronization
  • Internal Temperature Monitor
  • Soft-Start/Voltage Tracking
  • Output Overvoltage Protection
  • 16mm × 16mm × 5.01mm BGAPackages

RE4650 Dual 25A / Single 50A High-Current DC/DC Step-Down Power Module

The RE4650 is an integrated dual 25A or single 50A step-down DC/DC regulator that incorporates switching controllers, power FETs, inductors and all supporting components within a single package. It works over a 4.5V–15V wide input voltage range and provides two independent outputs with adjustable 0.6V–1.8V output voltage, where each channel’s voltage can be set easily with one external resistor. Its high-efficiency design supplies up to 25A continuous current per output, and only a small quantity of input and output capacitors are required for peripheral circuits. This power module supports external frequency synchronization, multiphase parallel operation and output voltage tracking for orderly power rail sequencing, equipped with an onboard temperature diode to realize real-time device temperature monitoring. Adopting high switching frequency and current-mode control architecture, it delivers ultra-fast transient response against line and load fluctuations without compromising system stability, and integrates built-in overvoltage and overcurrent protection to avoid circuit damage. The RE4650 features full pin-to-pin and BOM-to-BOM compatibility with LTM4650, enabling direct replacement and convenient product upgrade iteration.

Application Schematic

RE4650 is a dual 25A / single 50A industrial-grade high-current power module, operating under 4.5V~15V input voltage. The input side uses four 22μF parallel capacitors for high-current filtering, the TEMP pin matches a 120k resistor for temperature monitoring, and RUN1/RUN2 independently control two channels. TRACK1/TRACK2 realize power rail tracking sequencing, the INTVcc pin is connected with 10k resistor and 4.7μF capacitor for internal power supply filtering, and dual PGOOD pins feed back power status separately. The FSET pin configures switching frequency, PHASMD and MODE_PLLIN pins are used for multi-phase phase-locked configuration. VFB1/VFB2 set output voltage, and DIFFOUT, DIFFP, DIFFN realize precise differential voltage sampling. After dual-channel parallel connection, the module can stably output 1.2V/50A large current, with multi-group high-capacity parallel capacitors on the output side to reduce high-current ripple, widely applied in server, industrial inverter power supply.

APPLICATION

  • CPUs, FPGAs, DSPs and ASICsApplications
  • Telecom and NetworkingEquipment
  • Industrial Equipment

BGA PACKAGE-TOP VIEW

Dual-channel ultra-high density refined BGA Layout
Ultra-dense dual-channel BGA top view with refined pin grouping, M-A ×1-12 large grid layout. Enlarged centralized SGND & power GND pads optimize grounding impedance, dual compensation loops and dual feedback pins are closely matched for loop stability optimization. Differential sampling pins are concentrated on the right side, phase modulation and PLL pins are placed on the left control zone, temperature and external power pins are fixed on the top central position.
Ultra-fine pin arrangement achieves higher power density, excellent anti-interference and thermal performance, customized for high-current ASIC, high-end optical communication equipment and precision industrial power conversion scenarios.

Fields of Application

  • CPUs, FPGAs, DSPs and ASICs Applications:
    Powers high-end Xilinx Versal ACAPs and Intel Agilex FPGAs. The dual 25A (or single 50A) outputs deliver massive current for programmable logic and AI engines, while differential remote sensing compensates for IR drops in large BGA packages. Multiphase parallel capability scales to 100A+ for GPU power delivery, and fast transient response handles sudden load steps during AI inference workloads.
  • Telecom and Networking Equipment:
    Designed for 400G/800G optical DSPs and core router forwarding engines. The high current density supports power-hungry 7nm/5nm ASICs, while low loop inductance minimizes voltage overshoot/undershoot during packet bursts. Onboard temperature monitoring provides thermal telemetry to system managers, preventing throttling in high-port-density switches.
  • Industrial Equipment:
    Powers industrial PCs and machine vision controllers. The dual rails independently supply high-performance CPUs and FPGA-based frame grabbers, isolating noise. Wide input range tolerates noisy 12V industrial supplies, while robust protection ensures uptime in harsh environments. Compact 16mm×16mm size fits in ruggedized embedded computers for factory automation.
  • Data Center Servers:
    Powers CPU Vcore rails in 1U cloud servers. The 50A capability supports Intel Xeon and AMD EPYC processors, while multiphase operation reduces input capacitance requirements. High efficiency minimizes cooling costs in hyperscale data centers, and PMBus compatibility (if supported) enables digital power management for rack-level energy optimization.
  • AI Inference Accelerators:
    Powers edge AI boxes and neural network processors. The high current supports NPUs and GPUs running ResNet-50 or BERT models, while fast transient response handles dynamic voltage scaling during inference. Low noise ensures accurate analog-to-digital conversion in sensor fusion applications, and high reliability ensures consistent performance in autonomous vehicle perception systems.

Core product advantages

Flagship High-current High-density Integrated Power Module

As flagship high-current power module, RE4650 encapsulates complex high-power switch circuits, power MOSFETs and inductors inside 16mm×16mm×5.01mm standardized BGA package, providing dual 25A / single 50A ultra-large current output. Highly integrated design avoids messy discrete high-current wiring, compact packaging matches server mainboard, communication core router and high-performance computing board layout, greatly solving layout difficulty of low-voltage large-current power supply for top-tier CPU, FPGA and ASIC chips.

Precision Remote Sampling & Scalable Large-current Stability

Equipped with differential remote sampling amplifier, RE4650 accurately compensates PCB line pressure drop, controlling load-point voltage precision within ±1.5%. Multi-phase parallel and frequency synchronization support expansion to hundred-ampere high-power system, ultra-fast dynamic response copes with peak power surge of AI computing chips. Optimized low-voltage output of 0.6V~1.8V brings ultra-high conversion efficiency, stable operation in -55℃~125℃ meets long-term continuous operation demand of data center and communication base station.

LTM4650 Compatible Replacement for High-end Hardware Upgrade

Complete pin-to-pin and BOM compatibility with LTM4650 allows high-end computing and communication manufacturers to replace imported power supplies directly without board redesign, greatly reducing hardware upgrade cycle. Unified packaging standard is compatible with existing automated production lines, stable high-current performance avoids power supply replacement and derating transformation, alleviates high-end chip supply pressure, improves long-term production stability of data center core equipment.

Foldback Current Limiting & Chip-level High-standard Protection

Built-in foldback overcurrent limiting, overvoltage lockout and overtemperature shutdown mechanism provide bank-grade protection for expensive core processors. On-chip temperature diode feeds real-time heating data to remote monitoring platform, PGOOD signal judges power rail stability to prevent system crash during startup and load mutation. Simple peripheral matching and mature configuration technology reduce high-end equipment debugging difficulty, realizing long-term unattended safe operation for computing center and backbone communication equipment.

High-Current Dual Power, Perfectly Engineered

Discover the pinnacle of high-power compact conversion with Sajet’s RE4650 integrated dual-channel DC/DC step-down module. Built with two independent power channels, the device supports dual 25A continuous outputs or a combined single 50A ultra-large current output, paired with precise resistor voltage setting to deliver steady 0.6V–1.8V adjustable outputs and stable power supply for high-end CPUs, FPGAs, ASICs and AI computing mainboards. Adopting high-frequency current-mode control with differential remote sampling amplifier, it accurately compensates PCB line voltage drop to lock load-point voltage precision within ±1.5% and achieves ultra-fast transient response to counteract steep peak power surges of high-performance chips, while comprehensive overvoltage, overcurrent foldback and overtemperature protection plus built-in temperature monitor safeguards full-module circuit safety. The standardized compact 16mm×16mm×5.01mm BGA package fully integrates switching controllers, power MOSFETs and inductors, requiring only a small set of external capacitors to eliminate messy discrete high-current wiring and drastically simplify dense PCB layout design. It features complete pin-to-pin and BOM-to-BOM compatibility with LTM4650 for seamless direct replacement without PCB redesign or secondary hardware verification, alongside multi-functional expansion including adjustable switching frequency, external frequency synchronization, multiphase current-sharing parallel connection for hundred-ampere power system expansion and soft-start voltage tracking. From data center servers, communication core routers and high-performance computing hardware to industrial high-power control equipment, trust Sajet’s RE4650 to deliver reliable, ultra-efficient low-voltage large-current power regulation solutions for top-tier high-demand scenarios. Contact us today to discuss your application requirements.

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  • We ordered 8,000 units of Sajet RE4650 for entry-level AI computing server motherboard core power rails. It provides dual independent 25A channels or combined single 50A ultra-high continuous current, perfectly powering high-end server CPUs and low-voltage FPGAs. Differential remote sampling amplifier precisely offsets PCB trace voltage drop, holding load voltage accuracy within ±1.5%. Full pin-to-pin & BOM compatibility with LTM4650 allowed direct hardware replacement without PCB redesign, shortening our server new product launch timeline drastically. Overcurrent foldback and built-in temperature monitor protect chips during AI computing peak power surges, and we signed a long-term quarterly supply framework agreement.

  • After extensive thermal and transient load bench testing, we fully adopted RE4650 for compact FPGA accelerator card core power. Narrow 0.6V–1.8V output range matches low-core-voltage high-current FPGA requirements, while ultra-fast transient response instantly counteracts steep power spikes during large-scale parallel AI calculations. The fully integrated 16mm×16mm BGA eliminates messy discrete high-current power wiring, simplifying dense server PCB layout. Multiphase parallel expansion lets us stack multiple modules to build hundred-ampere power subsystems for top-tier accelerators, with outstanding cross-batch parameter consistency.

  • We replaced original imported high-current power regulators with RE4650 for cloud telecom server power boards. Adjustable switching frequency reduces switching noise interference with high-speed data transmission circuits inside server racks. Wide operating temperature range maintains stable 7×24h operation in warm data center environments, and comprehensive overvoltage, foldback OCP and thermal protection cuts server hardware failure rates significantly. We achieved a 33% reduction in high-current power rail BOM cost, and quarterly order quantities will be increased by 50% for next-gen server production lines.

  • We purchased RE4650 sample batches for compact edge supercomputing node prototype development. Only a minimal set of external input/output capacitors is needed thanks to full internal integration of power stages. Soft-start voltage tracking avoids dangerous CPU inrush current on power-on, and internal temperature diode enables real-time system thermal monitoring. Accelerated load surge testing verified stable 50A combined output performance, making it our primary high-current power module candidate for upcoming mass-produced edge computing hardware.

Alternative Names

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